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Texas Instruments Careers Apply For Semiconductor Packaging Engineer Jobs In Pampanga
Texas Instruments Careers- Hey Guys, Good Employment Opportunity For Those Guys Who Looking or Jobs In Texas Instruments Becouse Recently Texas Instruments Recently Published A Recruitment Notification On Thier Official Employment / Careers Portal. So Candidates Who Take Interest In Apply For Semiconductor Packaging Engineer Jobs In Texas Instruments Philippines. This Position Hired For Pampanga Location. Candidates Who Selected In This Hiring Will Get Full Remuneration Of Thier Work. Company Paying A Roughly Pay Of ₱ 24708.00 per month For Semiconductor Packaging Engineer Position
Summery Of Texas Instruments Semiconductor Packaging Engineer Jobs Pampanga | online jobs for students philippines
|Recruiting Company / Department :- Texas Instruments
Hiring Position :- Semiconductor Packaging Engineer
Payout or Salary :- Roughly Pay Of ₱ 24708.00 per month
Apply On:- careers.ti.com
Texas Instruments Careers | Job Description
Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors. By employing the world’s brightest minds, TI creates innovations that shape the future of technology. TI is helping about 100,000 customers transform the future, today. We’re committed to building a better future – from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities and developing great minds. Put your talent to work with us – change the world, love your job!
About the job
As a member of our packaging team, you’ll have the chance to interact with many product groups and functions. You’ll have high visibility on your projects, with strong opportunities for growth both within our team and across the SC Packaging organization.
Responsibilities may include:
- Develop new package requirements and maintaining quality of existing packages for all product groups
- Define package requirements for product groups and customer requirements
- Develop new package and process qualification programs.
- Perform integrity analysis of packages utilizing appropriate tools
- Perform package characterizations including cost effectiveness studies.
- Act as a liaison with vendors
- Maintain product quality while developing and introducing package cost reduction programs
- Coordinate the introduction of new package processes into production
- Prepare and/or updates specifications for piece parts of integrated circuits or semiconductor assemblies
- Minimum 2 years of Compression Molding process/equipment engineering experience; or minimum 5 years of Transfer Molding process/equipment engineering experience
- Bachelor’s degree in Electrical/Electronics Engineering, Materials Engineering, Chemical Engineering, Mechanical Engineering, and other relevant engineering courses
- Demonstrated strong analytical and problem solving skills
- Strong verbal and written communication skills
- Ability to work in teams and collaborate effectively with people in different functions
- Strong time management skills that enable on-time project delivery
- Demonstrated ability to build strong, influential relationships
- Ability to work effectively in a fast-paced and rapidly changing environment
- Ability to take the initiative and drive for results
To be considered for this position, please apply.